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Wafer Inspection System@WIS-2010C
Wafer Inspection System WIS-2010C This system can inspect the thickness measurement (Bow/Warp), resistance measurement, microcrack inspection and surface / backside inspection. System throughput is 1 second/wafer.
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Module dk Inspection System@MEI
Module EL Inspection System MEI This system can inspect the crack inspection, electric short-circuit inspection and scratch inspection. The thermal inspection unit by the wiring short circuit can be installed with the option.
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Solar Cell Transportation TR-1000L
Solar Cell Transportation TR-1000L This system supplies one piece of wafer per one second, and transports the stacked wafer.
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