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Wafer Thickness Measuring System
 Wafer Thickness Measuring System

This system is the wafer thickness measuring system with transfer function and thickness measuring function. It is possible to measure the thickness of each point in the specified wafer. 6 inch and 8 inch are supported.

specification

Wafer size 150mm, 200mm
Wafer transportation method

Bernoulli method
System configuration ・Transportation unit
・Loader / unloader unit (4 carriers installed)
・Alignment unit
・ID recognition unit (for 8-inch glass only)
・Thickness measurement unit
・Upward communication function (option)
Dimension

1580(W)×1580(D)×1900(H) mm

* This dimension doesn't contain the height of the protrusion.

* This is an example of the product specification. We supports customized specifications.