The wafer set in the loader is taken out by the transfer robot. After alignment, the wafer is reversed and transferred to the module machine stage. Then the wafer is automatically transferred to the original cassette.
It can be connected to the desired module machine.
Wafer size
300mm
Wafer transportation method
Back side adsorption method
System configuration
・Transportation unit
・Loader unit
・Alignment unit
・Stage unit for module machine
(can be connected to the desired module machine)
・Upward communication function (option)
Dimension
2070(W)×1650(D)×1860(H) mm
* This dimension doesn't contain the height of the protrusion.
* This is an example of the product specification. We supports customized specifications.
