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Wafer Automatic Appearance Inspection System
Wafer Automatic Appearance Inspection System

This is the wafer automatic appearance inspection system equipped with surface inspection unit and back inspection unit. From visual inspection by the operator corresponds to automation of inspection system.

specification

Wafer size 300mm@V Notch
Wafer transportation method

Edge grip method

System configuration ETransportation unit
EFOUP openers (2 units)
Ealignment unit
EInspection unit (Surface inspection unit and Back inspection unit)
EUpward communication function (option)
Dimension

1655(W)~2175(D)~2000(H) mm

* This dimension doesn't contain the height of the protrusion.

* This is an example of the product specification. We supports customized specifications.