This is the wafer automatic appearance inspection system equipped with surface inspection unit and back inspection unit. From visual inspection by the operator corresponds to automation of inspection system.
Wafer size
300mm@V Notch
Wafer transportation method
Edge grip method
System configuration
ETransportation unit
EFOUP openers (2 units)
EAlignment unit
EInspection unit (Surface inspection unit and Back inspection unit)
EUpward communication function (option)
Dimension
1655(W)~2175(D)~2000(H) mm
* This dimension doesn't contain the height of the protrusion.
* This is an example of the product specification. We supports customized specifications.