¡Wafer Inspection System@WIS-2010C | ||||
This system can inspect the thickness measurement (Bow/Warp), resistance measurement, microcrack inspection and surface / backside inspection. System throughput is 1 second/wafer. Ë Products deteil |
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¡Module dk Inspection System@MEI | ||||
This system can inspect the crack inspection, electric short-circuit inspection and scratch inspection. The thermal inspection unit by the wiring short circuit can be installed with the option. Ë Products deteil |
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¡Solar Cell Transportation TR-1000L | ||||
This system supplies one piece of wafer per one second, and transports the stacked wafer. Ë Products deteil |
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