This inspection system automatically detects defects on the wafer surface. From visual inspection by the operator corresponds to automation of inspection system. We can suggest the optimum system by actually imaging and inspecting the detection target.
Wafer size
200mm@OF, V Notch
Wafer transportation method
Back side adsorption method
System configuration
ETransportation unit
ELoader / unloader unit
EAlignment unit
ESurface inspection unit
EUpward communication function (option)
Dimension
1250(W)~1700(D)~1800(H) mm
* This dimension doesn't contain the height of the protrusion.
* This is an example of the product specification. We supports customized specifications.