This equipment cleans the wafer surface after dicing with two fluids, pure water and air. Controls the re-adhesion of airborne dust with the originally developed wash cup.
Ring frame size
200mm, 300mm
Wafer transportation method
Transfer from upper or lower wafer cassette can be selected
System configuration
ELoader / unloader unit
ETransportation unit
EWashing unit
Dimension
800(W)~1400(D)~1700(H) mm
* This dimension doesn't contain the height of the protrusion.
* This is an example of the product specification. We supports customized specifications.