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Top Products(Solar cell)
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Wafer Inspection System WIS-2010C This system can inspect the thickness measurement (Bow/Warp), resistance measurement, microcrack inspection and surface / backside inspection. System throughput is 1 second/wafer. The loader unit supports cassette method or stack method. The unloader unit can classify into 13 categories by inspection results. The lifetime measurement unit can be installed with the option.
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