RayResearch Corporation|Semiconductor Inspection System | Solar Cell Inspection System

Wafer Inspection System WIS-2010C

This system can inspect the thickness measurement (Bow/Warp), resistance measurement, microcrack inspection and surface / backside inspection. System throughput is 1 second/wafer. The loader unit supports cassette method or stack method. The unloader unit can classify into 13 categories by inspection results. The lifetime measurement unit can be installed with the option.

Wafer size	125mm square / 156mm square
Wafer type	Mono crystal wafer / Multi crystal wafer
Processing speed	1second / wafer
Inspection item	・Thickness and Bow/Warp measurement ・Resistance measurement ・Microcrack inSurface / Backside inspection ・Lifetime measurement (Option)
Dimension	4000(W)×1200(D)×1800(H)　mm