Month / Year |
History |
Aug. 2000 |
RayResearch Corporation established in Gunma with JPY 10,000,000 initial capital |
Sep. 2000 |
Developed Wafer Bevel Scratched Inspection System |
Nov. 2000 |
Developed Wafer Sorter TR100 |
Jul. 2001 |
Developed Wafer Backside Scratches Inspection System Developed Inspection System Coordinate Transformation software |
Sep. 2001 |
Developed Wafer Sorter TR100F |
Apr. 2002 |
Developed Mold System Imade Processing |
Jun. 2002 |
Developed Wafer Backside Inspection System |
Jan. 2003 |
Developed Wafer Backside Scratches Inspection Unit (High-speed type) |
Sep. 2003 |
Headquarters moved Developed Wafer Surface/Backside Scratches Inspection Unit |
Oct. 2003 |
Developed Sensitive Wafer Backside Scratches Inspection Unit |
Apr. 2004 |
Developed Wafer Sorter |
May. 2005 |
Developed Wafer Thickness Measuring System Developed Wafer Edge Scratches Inspection System |
Jun. 2005 |
Developed Wafer Backside Scratches / Crystal Defect Inspection Unit |
Sep. 2005 |
Developed Wafer Crystal Defect Inspection Unit |
Nov. 2005 |
Developed Sensitive Wafer Crystal Defects Inspection Unit (High-speed type) |
Jan. 2006 |
Developed Infrared Ray Defects Detection System |
Oct. 2006 |
Developed QR-code Reader System |
Mar. 2007 |
Developed Infrared Ray Defects Detection System (With transportation machine) |
Apr. 2007 |
Headquarters moved |
Jun. 2007 |
Developed FT-IR Measuring System |
Nov. 2007 |
Infinity Corporation and merger |
Dec. 2007 |
Developed Wafer Sorter TR100RS(For thin wafer) Developed Wafer Sorter TR100-mini |
Feb. 2008 |
Developed FOUP Opener FO-300 |
Apr. 2008 |
Developed Wafer Carrier Distortion Tester ASI-10 |
Nov. 2008 |
Developed Wafer Inspection System WIS-5155 |
Jul. 2009 |
Developed Module EL Inspection System MEI (Stand-alone type) |
Mar. 2010 |
Developed Wafer Inspection System WIS-2010C |
Apr. 2010 |
Developed Module EL Inspection System MEI (In-line type) |
Feb. 2011 |
Developed Module Cell Inspection System MEI (Manual type) |
Mar. 2011 |
Developed Inline Wafer Inspection System WIS-2011C/WIS2011M |
Jul. 2011 |
Developed EL / Simple Module Inspection Unit |
Sep. 2011 |
Developed Wafer Transfer Machine SWT100 |
Dec. 2011 |
Developed IR Inspection Unit IRI300 |
Jun. 2012 |
Developed Wafer Mapping Unit MP3-25 |
Jan. 2013 |
Developed Wafer Sorter SR100S |
Mar. 2013 |
Developed Visual Inspection System MPI-600 |
Nov. 2013 |
Developed Wafer Sorter TR100T |
Sep. 2014 |
Developed Polishing Surface Plate Scratch Detection System KTI-15J
Developed Wafer Thickness Measuring System TR100WT |
Oct. 2014 |
Developed Gap discrimination sensor GPS4M |
Feb. 2015 |
Developed Transfer System (For FT-IR Measuring System) FT-IR1200 |
Jun. 2015 |
Developed Chip Washer System |
Feb. 2016 |
Developed ƒ³300 EFEM for mercury prober CV300 |
Mar. 2016 |
Developed Wafer Automatic Appearance Inspection System |
May. 2016 |
Developed IR Inspection System (P ++ Support) IRI300 |
Aug. 2016 |
Developed 8 Inch Surface Automatic Inspection System SLI-200 |
May. 2017 |
Developed Wafer Handling Machine For FT-IR300 |
Jun. 2017 |
Headquarters moved |
Dec. 2018 |
Developed Wafer Transfer System (For FT-IR) FT-IR1200T |
Jan. 2019 |
Developed Wafer Transfer System (For FT-IR) Inline Support FT-IR1200Inline |